The Department of Materials Engineering at the University of Technology awarded a master's degree to the student, Zainab Kazem Hamza, Department of Materials Engineering / University of Technology for her thesis titled
“Experimental Investigation of Thermal Contact Resistance by using different thermal Interface Materials Across Different metallic Pairs”
the discussion took place in the postgraduate hall located in Building B within the department on Thursday, 26/10/2023 at nine o'clock in the morning, and the discussion committee consisted of ladies and Gentlemen
Asst. Prof. Dr. Laith Waddah Ismail , Chairman Prof.
Asst. Prof. Dr. Hind Basil Ali , member
Asst. Lec. Dr. Ali Abdul Karim Mohsen, member
Asst. Prof. Dr. Ayad Kazem Hassan, as a member and supervisor
Asst. Prof. Dr. Kazem Matar Shabib, as a member and supervisor
In addition, the thesis was scientifically evaluated by Prof. Dr. Jassim Muhammad Abdel Latif/ University of Diyala/ College of Engineering/ Department of Mechanical Engineering and Prof. Dr. Khaled Faisal Sultan/University of Technology/Department of Electromechanical Engineering, and linguistically by Asst. prof. Dr. Jamal Jalal Daoud/ University of Technology/Department of Materials Engineering.
After the examination committee recorded its comments on the thesis, which covered both explanation and correction, the student's defense of her thesis, and the conclusion of the discussion, the committee convened to evaluate the thesis. They decided to award the student a Master’s degree with a pass grade
Abstract:
This experimental study aims to improve the efficiency of thermal applications by achieving the lowest possible thermal contact resistance(TCR) between different metal pairs (copper, aluminium, brass) using multiple intermetallic materials (aluminum foil, copper foil, brass foil) and applying varying pressures. All experiments were conducted by A thermal system was designed and manufactured for this work. The study concluded that using aluminum foil as an interface material gave the lowest thermal contact resistance compared to other interface materials.
